Power Noise in TSV-Based 3-D Integrated Circuits
نویسندگان
چکیده
منابع مشابه
Power Grid Noise in TSV-Based 3-D Integrated Systems
A 3-D test circuit examining power grid noise in a 3-D integrated stack has been designed, fabricated, and tested. Fabrication and vertical bonding were performed by MIT Lincoln Laboratory for a 150 nm, three metal layer SOI process. Three wafers are vertically bonded to form a 3-D stack. Noise analysis of a power delivery topology is described. The effect of the through silicon via (TSV) densi...
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Acknowledgments First, I would like to thank Professor Eby G. Friedman, my research and thesis adviser throughout my master's studies. It is his brilliant suggestion and patient guidance on my research that makes this work possible. His character of responsibility and wisdom on life deserves my study for my entire life. I appreciate the opportunity to work with Professor Eby G. Friedman and for...
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Roshan Weerasekera, Dinesh Pamunuwa, Matt Grange † †Centre for Microsystems Engineering, Faculty of Science & Technology, Lancaster University, Lancaster LA1 4YR, UK. Email: {r.weerasekera,d.pamunuwa,m.grange}@lancaster.ac.uk Hannu Tenhunen, Li-Rong Zheng ∗ Department of Electronics, Computer, and Software Systems, KTH School of Information and Communication Technologies, ELECTRUM 229, 164 40 K...
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Global interconnect design for threedimensional integrated circuits is a crucial task. Despite the importance of this task, limited results related to global issues have been presented. Challenges in reliably distributing power, ground, and the clock signal within a multi-plane integrated system are discussed in this paper. The design of two 3-D test circuits addressing these issues is describe...
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ژورنال
عنوان ژورنال: IEEE Journal of Solid-State Circuits
سال: 2013
ISSN: 0018-9200,1558-173X
DOI: 10.1109/jssc.2012.2217891